Plasma Etch, Inc. has developed a technology called the Magna Series(patent pending) that eliminates the need of CF4 gas that is presently used by printed circuit board manufacturers throughout the world with the use of plasma etching systems for desmear and etchback processing applications.
The Magna Series Technology is a great achievement and advancement in the protection of the global environment and preservation of our ozone layer. The new product eliminates the need of CF4 gases, does not require the use of O2 bottles, and uses less power than traditional plasma etching systems that are currently in use.
Plasma Etch reports the Magna Series has also set new market standards in several other key areas. The new technology provides faster etch times, lower operating cost, and process uniformity that is not achievable by using existing technologies.